API Heat Transfer to Showcase at Asia Data Center Expo 2026, Empowering the Data Center Industry with High-Efficiency Heat Exchange Technology

The 12th Asia Data Center Expo will be held at Marina Bay Sands Expo and Convention Centre in Singapore from September 29 to 30. As a seasoned heat transfer solutions provider with 147 years of expertise in the industrial heat exchange sector, API Heat Transfer will present its full suite of technology achievements and service systems tailored for data center scenarios at Booth 3-G5. The company will share its technical heritage in thermal management with the Asia-Pacific market, and collaborate with global industry partners to explore high-quality development paths for intelligent computing infrastructure.

As one of the most influential industry events in the Asia-Pacific data center sector, this year’s expo centers on the theme "Shaping the Future of Data Centers". It focuses on innovation and resilience for the cornerstone of the digital economy, covering core topics including infrastructure modernization, AI-ready environment construction, and digital operation upgrading. The event serves as a pivotal platform for the industry to connect with cutting-edge technologies and advance collaborative projects.

Against the backdrop of the rapid large-scale deployment of AI large models and high-density intelligent computing clusters, the heat dissipation efficiency, operational stability, and full-lifecycle energy performance of data centers have become core factors determining the high-quality development of computing power infrastructure. Traditional cooling solutions can no longer meet the stringent requirements of high-density computing scenarios, driving sustained industry demand for customized thermal management solutions that combine exceptional heat exchange efficiency and high operational reliability.

Leveraging decades of technical expertise in industrial heat exchangers, and extensive project delivery experience across harsh operating conditions in global industrial OEM, energy and chemical, power electronics and other sectors, API Heat Transfer has completed targeted technical optimization for high-density data center computing scenarios. At the exhibition, the company will highlight its product matrix of plate and shell-and-tube heat exchangers, plate-fin heat exchangers, as well as customized thermal management solutions for liquid-cooled data centers and indirect evaporative cooling systems. These solutions help data center operators effectively reduce PUE, improve the operational stability of core computing equipment, and achieve dual optimization of energy consumption and maintenance costs while supporting large-scale computing power deployment.

For the fast-growing data center market in the Asia-Pacific region, API Heat Transfer will use this exhibition as an opportunity to further clearly communicate its technical and service capabilities to industry clients. The company will deliver comprehensive technical support spanning solution design, product delivery, and full-cycle maintenance for data center projects of different scales and computing densities, providing reliable heat exchange support for the construction of green computing power infrastructure.

During the exhibition, API Heat Transfer’s professional team will be on-site full-time at Booth 3-G5 to provide one-on-one demand-matching services for visitors. The team will engage in in-depth exchanges with global industry peers on core industry topics including data center cooling system upgrading, green computing power construction, and the implementation of customized heat exchange solutions, to jointly promote the efficient and sustainable development of data center infrastructure.

About API Heat Transfer

The history of API Heat Transfer dates back to 1879, marking nearly 147 years of continuous dedication to the industrial heat exchange sector. Since its founding, the company has consistently stayed at the forefront of industry technology. Starting from a single heat exchange product in its early days, it has gradually completed a full-category technology layout, and now boasts a complete diversified product line covering plate, shell-and-tube, and air-cooled heat exchangers. Over three centuries of development, API Heat Transfer has not only been a full witness to the evolution of the global industrial heat exchange industry, but also a core participant driving product iteration and industrial upgrading through technological innovation, long leading the direction of industry technological advancement.

Supported by profound technical heritage and stable, superior product performance, API Heat Transfer’s solutions have earned wide customer recognition and high industry acclaim in the global industrial market. The company operates five independent professional brands — Airtech®, Basco®, General ThermoDynamics®, Schmidt® and Thermal Transfer Products®. Each brand carries its own exclusive technical heritage and differentiated design positioning, forming unique technical advantages in its respective application fields, continuously delivering customized heat exchange support for harsh operating scenarios across different industries, and collectively driving the technological advancement of the global industrial heat exchange sector.