SANTA CLARA, Calif. — August 5, 2026 — DapuStor is showcasing its latest enterprise storage innovations at FMS 2026, including a new 512TB R6060 PCIe 5.0 QLC SSD, demonstrated onsite through a performance test video. The company also introduced a liquid-cooled R6 E1.S SSD, mixed-mode J5060 QLC solutions, and dual-port R6 E3.S SSDs available in both TLC and QLC, alongside a broad EDSFF enterprise SSD portfolio.

 

 

512TB R6060: 1PB with Two SSDs

The new R6060 512TB PCIe 5.0 QLC SSD doubles the capacity of DapuStor's previous 245TB design, enabling 1PB of flash capacity with just two drives.

Available in next-generation EDSFF form factors including E3.L and E2, the drive is designed for large AI datasets and capacity-intensive infrastructure. Higher per-drive density reduces the number of SSDs required at scale, helping data centers optimize rack space, power consumption and overall TCO.

 

Liquid-Cooled E1.S for Dense AI Infrastructure

DapuStor also unveiled an 8TB R6 PCIe 5.0 TLC E1.S SSD with cold-plate liquid-cooling support. The compact E1.S form factor combines high performance with improved thermal management, supporting dense deployment in GPU-intensive AI servers and liquid-cooled data center environments.

 

Mixed-Mode QLC for Performance and Capacity

The J5060 QLC Series supports mixed SLC and QLC deployment, allowing systems to combine a high-performance flash tier with high-capacity QLC storage within the same architecture. This provides greater flexibility for AI workloads that require both fast data access and efficient use of storage capacity.

 

Dual-Port E3.S Across TLC and QLC

DapuStor is also showcasing R6 E3.S dual-port enterprise SSDs across both TLC and QLC configurations. TLC models scale up to 30.72TB, while QLC models reach 61.44TB.

The portfolio combines high-performance TLC and high-capacity QLC in the compact E3.S form factor, while dual-port support provides additional path redundancy for high-availability enterprise and AI storage systems.