SINGAPORE, Sept. 29, 2026 — Dow (NYSE: DOW) today showcases an integrated portfolio of thermal management solutions for artificial intelligence and high-performance computing infrastructure at Data Center World Asia 2026. At Booth T20, Basement 2, Sands Expo and Convention Centre, Dow is demonstrating how materials, testing and lifecycle services can help data center operators manage rising heat loads from Sept. 29-30.

As AI increases compute and power density across chips, servers, racks and facilities, thermal management is becoming a critical constraint on performance, uptime, energy efficiency and scale. Dow’s exhibit connects the full heat path—from electronic interfaces to direct liquid cooling, immersion systems and facility loops—within one system-level approach.

At Data Center World Asia, Dow will highlight Dow™ Cooling Science which combines materials science, engineering, application testing and customer co-development. The platform helps customers evaluate materials, components, cooling architectures and validation requirements during earlier stages of system design instead of treating cooling as a collection of separate product choices.

“AI is redefining thermal requirements across data center infrastructure, making cooling a system-design priority rather than a downstream decision,” said Cathy Chu, global strategic marketing director, Dow Consumer Solutions. “Dow™ Cooling Science brings together materials innovation, testing and customer co-development to help our customers and the broader ecosystem develop more reliable, efficient and scalable AI infrastructure.”

"As liquid cooling adoption accelerates, customers are seeking trusted partners that can support both fluid performance and long-term system health," said Eric Shao, Asia Pacific marketing director, Dow Industrial Solutions. "With Dow’s advanced coolant technologies combined with expert monitoring and maintenance services through the Dow Coolant Care Network, Dow helps customers with cooling performance and mitigation support for fluid-related operational risk.

Solutions across the AI cooling system

At Booth T20, visitors can explore Dow solutions and technical capabilities across interconnected areas:

Thermal interface materials for AI servers and high-speed connectivity

DOWSIL™ thermal gels, greases and gums help transfer heat from optical modules, CPUs, GPUs, power modules and server assemblies. Featured technologies are designed for medium to high thermal conductivity, support thin bond lines and accommodate rework, while helping manage reliability and performance in high-density assemblies.

Applications include AI server processors, power modules and optical transceivers operating at 400G, 800G and 1.6T speeds, where effective heat dissipation can help support signal integrity and device reliability.

Direct-to-chip and facility-loop cooling fluids

DOWFROST™ LC 25 Heat Transfer Fluid supports heat removal and corrosion protection in direct-to-chip systems, including those with high-surface-area copper components.

DOWFROST™ HD Heat Transfer Fluid supports primary facility circuits, enabling Dow to address facility-side cooling loops.

During the exhibition, Dow will also share insights and learnings from its work with more than 15 customers across Asia Pacific using DOWFROST™ LC 25, as well as guidance on fill quality, fluid-health monitoring and long-term loop management.

Single-phase immersion cooling

DOWSIL™ ICL-1100 Cooling Fluid is designed for single-phase immersion cooling by submerging components directly into a dielectric fluid with a high flash point of 200°C to maximize thermal efficiency and save physical space.

Lifecycle Support Through the Dow Coolant Care Network

Dow will present the concept of Dow Coolant Care Network, which connects coolant supply, sampling, laboratory testing, data analysis, specialist interpretation and mitigation support across primary and secondary cooling loops.

Through Dow-approved service providers and independent laboratories, the network helps operators monitor coolant condition, identify developing issues and support management of cooling-system performance over the fluid lifecycle.

Technical Presentations

Additionally to the technologies, Dow Technical Scientists will present on:

• Integrated thermal management for data centers and next-generation AI servers
• Direct-to-chip coolant chemistry, commissioning and operating experience
• Thermal interface materials for 800G and 1.6T optical transceivers and next-generation AI servers
• Lifecycle fluid management through the Dow Coolant Care Network

Visitors can meet Dow experts to discuss thermal challenges and explore how materials science, testing and co-development can support reliable, efficient and scalable AI infrastructure.

About Dow

Dow (NYSE: DOW) is one of the world’s leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, customer-focused innovation and leading business positions enable us to achieve profitable growth and help deliver a sustainable future. We operate manufacturing sites in 29 countries and employed approximately 34,600 people as of year-end 2025. Dow delivered sales of approximately $40 billion in 2025. References to Dow or the Company mean Dow Inc. and its subsidiaries. Learn more about us at www.dow.com.

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For further information, please contact:

Ang Yi Qin  yiqin@dow.com                                                                                   Coco He  CHe@dow.com