The artificial intelligence workload fundamentally alters the cooling requirements of data centers. As chip power densities increase, liquid cooling technology is evolved from a "high-end option" to a "survival necessity" in AI data centers.

When engineers were designing the cooling systems, their attention naturally focused on the cold plates, pumps and coolant distribution units. However, there was one component that quietly determined the reliability of the entire system over the course of many years of operation: the flexible hoses and tubes that connected everything together. 

EPDM is highly suitable for direct-to-chip liquid cooling because it is resistant to thermal aging, has low permeability to water vapor, and remains flexible without plasticizers, which helps maintain stable cooling performance over a long service life. However, merely indicating "EPDM" in the data sheet is not sufficient. The long-term reliability of the liquid cooling system largely depends on the formulation, curing, and manufacturing process of EPDM. 

EPDM rubber is usually vulcanized using one of two curing systems: sulfur or peroxide. The sulfur-cured EPDM has good initial mechanical properties and cost advantages. However, during the curing process, compounds may remain in the rubber matrix. The peroxide-cured EPDM is more stable, typically resulting in a purer polymer structure and fewer residual by-products. HANSA-FLEX peroxide-cured EPDM is highly suitable for circulating through the complex circuit paths within the server infrastructure in cooling fluids. More than ten years' successful experience in cloud provider has proved that HANSA-FLEX peroxide-cured EPDM is the best choice for liquid cooling.