Customized Extreme Heat Dissipation
Custom micron-level precision skived fin exclusive structure delivers uniform temperature distribution across high-power chips. Featuring low thermal resistance and ultra-high heat exchange efficiency, it fully satisfies cooling demands of high-power computing devices.
Low Flow Resistance Custom Flow Channels
Internal channels are optimized via fluid simulation to drastically reduce coolant flow resistance. Compatible with rated flow rates ≥0.5L/min, it cuts circulating pump power consumption and matches pipeline systems for large-scale liquid cooling clusters.
Simulation-Driven Precision Customization
Thermal simulation accurately locates chip hotspots for one-on-one targeted channel layout optimization. Full-dimensional customized development is available based on clients’ chip power, installation dimensions and flow rate requirements.
High Reliability Under All Working Conditions
Adopts scenario-oriented integrated sealing, anti-corrosion and anti-leakage structural design, effectively preventing long-term water corrosion and leakage risks, and ensuring continuous stable operation of cold plates throughout their entire service life.