DOWSIL™ TC-3065 and DOWSIL™ TC-3120 Thermal Gel

Designed for 400G and 800G optical modules applications to dissipate heat, both are re-workable after curing, no oil-bleed and high reliability in high temperature and humidity conditions.

DOWSIL™ TC-5960 Thermally Conductive Compound

One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in bare die electronics applications. DOWSIL™ TC-5960 is non-curing, with low thermal resistance.

DOWSIL™ TC-5888 Thermally Conductive Compound

One-part, gray, 5.2 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as microprocessor units (MPU) and power modules. DOWSIL™ TC-5888 Thermally Conductive Compound is non-curing, with low thermal resistance.

DOWSIL™ TC-3080

One-part, 7.0 W/mk thermally conductive ultra soft gel formulated to dissipate heat in electronics applications, like power chips, 5G, autonomous vehicles and telcom. DOWSIL™ TC-3080 is a room temperature cure product with accelerated heat cure and a long working time.