The Fan-Liquid Hybrid Rack Load Bank is specially developed for high-density AI data centers, HPC computing facilities and hybrid cooling infrastructure verification. Different from traditional single air-cooled or liquid-cooled load equipment, this unit integrates forced-air cooling modules and cold-plate liquid cooling modules in one standard rack enclosure. It can simultaneously simulate heat dissipation characteristics of liquid-cooled GPU chips and air-cooled auxiliary components inside AI servers, accurately reproducing the real thermal & electrical operating conditions of GB200 / GB300 and OCP ORv3 rack-level computing hardware.

Adopting modular architecture, air-cooled load section and liquid-cooled load section can operate independently or work synchronously. Users can flexibly adjust power distribution between air cooling and liquid cooling according to test requirements. It supports continuous variable resistive load output, covering wide power range for rack-level infrastructure commissioning.