Cloud & AI Infrastructure
Dev Ops Live
Cyber Security World
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Data Centre World Exhibitor Products
Remote Thermosiphon Cooling Module
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采用远程蒸发端与冷凝端结构，可灵活布置于狭小机箱;适配定制服务器及边缘计算设备，支持Intel Birch、AMD SP7、海光7等1U~5U平台，典型功耗450–600W
29-30 SEPTEMBER 2026
MARINA BAY SANDS
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