Cloud & AI Infrastructure
Dev Ops Live
Cyber Security World
Big Data & AI World 
Data Centre World Exhibitors
Dow
- Hyperscale Cloud Solutions
- Cooling and Environment
- Cooling
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Dow brings together deep materials science, thermal management experience, and application-level validation to help customers address the increasing heat, reliability, and performance demands of advanced systems across AI, hyperscale data center and high-performance computing. We provide cooling solutions focused on:
- Cooling for AI data centers: Direct-to-chip liquid cooling and immersion cooling liquid solutions
- Thermal interface materials for AI servers and optics
- Cooling Science Studio expertise and capabilities to accelerate co-development of advanced thermal management solutions from early-stage concepts to commercialization.
- Dow Coolant Care Network services
About Dow
Dow (NYSE: DOW) is one of the world’s leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, customer-focused innovation and leading business positions enable us to achieve profitable growth and help deliver a sustainable future. We operate manufacturing sites in 29 countries and employed approximately 34,600 people as of year-end 2025. Dow delivered sales of approximately $40 billion in 2025. References to Dow or the Company mean Dow Inc. and its subsidiaries. Learn more about us at www.dow.com.
Address
260 Orchard Road, #18-01 The Heeren,238855
Singapore
