Exhibitors

Guangdong CESKO General Electric Power Technology Co Ltd

Hall: Level 3 Stand: 3-G1
  • Cloud and AI Infrastructure Services
  • Electrical Systems
  • Power and Energy

More computing power demands more than simply more power. It demands a better power architecture.

As AI and HPC push rack density to new levels, the challenge is no longer only capacity. Power infrastructure must remain reliable under critical loads, adaptable as computing systems change, and scalable for what comes next.

CESKO develops power distribution infrastructure for data centers, AI computing centers, and High-Performance Computing (HPC) and Supercomputing Centers—connecting high-capacity power transmission with flexible, resilient distribution close to the computing load.

At the center of this architecture is the CESKO Solid-State Insulated Busway.

With main busway capacities from 1250A to 6300A, the system is designed for high-density computing environments. CESKO's solid-state insulation technology provides a robust insulation structure for demanding electrical environments, while redundant main-and-backup power paths support continuity for mission-critical computing loads.

Flexible power access and online expansion allow new loads and capacity to be added as computing requirements evolve—without designing today's infrastructure only for today's racks.

Beyond today's AC architecture, CESKO is also preparing for the industry's transition toward 800V DC, building a power platform designed not only for current data centers, but for the next generation of AI and high-performance computing.

High capacity. High reliability. Built to scale with computing.

Meet CESKO at Booth 3-G1.

Address

No. 88, Huanhu South Road, Xihu Information Industrial Park,Factory Building C, Shilong Town,
Dongguan
GuangDong
China

Website

https://www.ceskobusduct.com/

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