Exhibitors
TYSON COOLING CO., LTD
Hall: Level 3
Stand: 3-D1
- Edge Computing
- Cooling
- Infrastructure Management
Tyson Cooling is a high-tech company specializing in advanced thermal management solutions for high-performance computing chips and infrastructures. Addressing one of the most critical challenges in AI infrastructure—the efficient cooling of high-power CPUs and GPUs—we leverage innovative cooling technologies to improve system performance, reliability, and energy efficiency. Our solutions serve customers worldwide across artificial intelligence, data centers, advanced manufacturing, and other high-performance computing applications.
Address
No. 399 Danfeng Road, 1301, 13th Floor, Tower A, Building 2, Xixing Sub-district, Binjiang District,Hangzhou
Zhejiang
China
Website
https://www.tycooling.cnContact Exhibitor
-
八张VGA多卡并行液冷散热展示平台,采用开放式高密度布局与整机换热与温度监控能力,可作为AI/GPU高密度散热应用实机展示。
-
通过远程蒸发与冷凝结构实现多位置布局,解决机箱空间限制。
Cloud & AI Infrastructure
Cyber Security World
Big Data & AI World
Data Centre World )




























