Exhibitors
TYSON COOLING CO., LTD
Hall: Level 3
Stand: 3-D1
- Edge Computing
- Cooling
- Infrastructure Management
Tyson Cooling Co., Ltd.is a high-tech innovative enterprise specializing in high computing power chip cooling solutions. The company is facing the core challenge in the development of the AI industry - the thermal management problem of high-power chips such as CPU/GPU. With breakthrough heat dissipation technology as its core competitiveness, it is committed to providing efficient and reliable thermal management solutions for global artificial intelligence, data centers, high-end manufacturing and other fields
Address
No. 399 Danfeng Road, 1301, 13th Floor, Tower A, Building 2, Xixing Sub-district, Binjiang District,Hangzhou
Zhejiang
China
Website
https://www.tycooling.cnContact Exhibitor
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八张VGA多卡并行液冷散热展示平台,采用开放式高密度布局与整机换热与温度监控能力,可作为AI/GPU高密度散热应用实机展示。
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通过远程蒸发与冷凝结构实现多位置布局,解决机箱空间限制。
Cloud & AI Infrastructure
Cyber Security World
Big Data & AI World
Data Centre World )

























