Speakers
Dr. Daniel Kearney
Chief Technology Officer,
FIRMUS
Daniel Kearney, PhD, MBA (ASME Fellow) is the Chief Technology Officer at Firmus Technologies in Singapore, where he manages the development of an awarding winning AI infrastructure platform. In his position, Dr. Kearney directs hardware and software strategies to align with the Firmus’ vision of developing the most efficient AI Infrastructure to address the demands of the AI-Energy nexus.
Dr. Kearney began his career in applied research in Ireland, obtaining his doctorate in mechanical engineering with a focus on liquid cooling solutions for high heat flux silicon chips. He continued his research at several renowned European institutions, including the CEA in France and ABB Corporate Research Centre in Switzerland, specializing in thermal management solutions from die to data centre. Dr. Kearney has received several awards for his research and holds several patents, and has a prolific publication record in his field.
In 2018, Dr. Kearney began working at Amazon Web Services (AWS) as a Global Solutions Architect. He later moved to Singapore to serve as the ASEAN Head of Technology, where he managed the Enterprise Solutions Architecture function, supporting customers in utilizing Cloud technology to advance their digital transformation.
With ASME Dr. Kearney has been a member since 2006, and has held various leadership positions including ASME’s ECLIPSE Board of Governors (2013-14), Chair of the Switzerland Section (2016-2018), member of the Engineering Sciences Segment and member of the Nominating Committee.
Dr. Kearney holds a B.E in Mechanical Engineering from UCD Dublin, a Ph.D. in Experimental Heat Transfer and Fluid Mechanics from the University of Limerick, and an M.B.A. from IMD Switzerland, where he was valedictorian speaker. He is currently a Forbes Technology Council member, Board Member of the Irish Chamber of Commerce Singapore and a Chartered Engineer with Engineers Ireland.
Sessions
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30-Sep-2026Critical Infrastructure TheatrePanel - Tackling Heat: Deploying Next-Generation Cooling Technologies at Scale
Cloud & AI Infrastructure
Cyber Security World
Big Data & AI World
Data Centre World 




























