Cloud & AI Infrastructure
Dev Ops Live
Cyber Security World
Big Data & AI World 
Data Centre World Tech Week Singapore 2026
AI Fabric Cluster Options
30 Sept 2026
Open Compute Project (OCP) Tech Day
Learn about the trade-offs between Copper and Fiber Optics, PCIe and ESUN Ethernet, and UALink, as planned for new Hyperscale Data Center architectures.
AI infrastructure is entering a pivotal architectural shift. As hyperscale, on-prem, and edge AI deployments push beyond the limits of conventional copper interconnects and fixed network assumptions, system designers now face multiple viable paths for building next-generation GPU fabrics. PCIe Gen 6, ESUN, copper transport, and optics are reshaping the design space for both scale-up and scale-out AI architectures.
This session explores how platform architects may evaluate emerging fabric options across the dimensions that matter most: latency, power, reach, bandwidth density, scalability, cost, and deployment complexity.
By connecting ongoing OCP work in high-speed switch fabrics, transport technologies, and reference architectures, this session will provide a practical framework for evaluating next-generation AI fabric choices. Attendees will leave with a clearer understanding of where copper, PCIe, Ethernet, CPO, and DWDM fit in future hyperscale, on-prem, and edge AI infrastructure—and how to select the right architecture for each deployment scenario.
